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Changing the surface properties of the backside of a silicon wafer to repel oil and prevent particle binding

Choi et al. | Feb 14, 2025

Changing the surface properties of the backside of a silicon wafer to repel oil and prevent particle binding

Wafers, essential in microchip production, can develop issues like leveling problems and wafer slip due to the formation of silanol bonds on their backside, which attract silica particles and oil. Authors tested addressing this issue with a coating of [acetoxy(polyethyleneoxy)propyl]triethoxysilane (APTS) applied to the wafer’s backside, preventing particle binding and oil adherence.

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Computational Structure-Activity Relationship (SAR) of Berberine Analogs in Double-Stranded and G-Quadruplex DNA Binding Reveals Both Position and Target Dependence

Sun et al. | Dec 18, 2020

Computational Structure-Activity Relationship (SAR) of Berberine Analogs in Double-Stranded and G-Quadruplex DNA Binding Reveals Both Position and Target Dependence

Berberine, a natural product alkaloid, and its analogs have a wide range of medicinal properties, including antibacterial and anticancer effects. Here, the authors explored a library of alkyl or aryl berberine analogs to probe binding to double-stranded and G-quadruplex DNA. They determined that the nature of the substituent, the position of the substituent, and the nucleic acid target affect the free energy of binding of berberine analogs to DNA and G-quadruplex DNA, however berberine analogs did not result in net stabilization of G-quadruplex DNA.

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Converting SiO2 wafers to hydrophobic using chlorotrimethylsilane

Lee et al. | Aug 20, 2024

Converting SiO<sub>2</sub> wafers to hydrophobic using chlorotrimethylsilane

Semiconductors are the center of the fourth industrial revolution as they are key components for all electronics. Exposed wafers made of silicon (Si), which can easily oxidize, convert to silicon dioxide (SiO2). The surface of SiO2 wafers consists of many Si-OH bonds, allowing them to easily bond with water, resulting in a “wet” or hydrophilic condition. We sought to determine a way to modify the surface of SiO2 wafers to become hydrophobic to ensure safe wet cleaning.

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