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Changing the surface properties of the backside of a silicon wafer to repel oil and prevent particle binding

Choi et al. | Feb 14, 2025

Changing the surface properties of the backside of a silicon wafer to repel oil and prevent particle binding

Wafers, essential in microchip production, can develop issues like leveling problems and wafer slip due to the formation of silanol bonds on their backside, which attract silica particles and oil. Authors tested addressing this issue with a coating of [acetoxy(polyethyleneoxy)propyl]triethoxysilane (APTS) applied to the wafer’s backside, preventing particle binding and oil adherence.

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Influence of induction heating on static recrystallization kinetics of AISI 4130 steel

Chen et al. | Apr 30, 2026

Influence of induction heating on static recrystallization kinetics of AISI 4130 steel

This article investigates whether induction heating can speed up static recrystallization in AISI 4130 steel compared with traditional radiant heating. It was found that induction-heated samples recrystallized faster, softened more quickly, and showed earlier microstructural changes like grain nucleation and pearlite spheroidization, suggesting induction heating could be a more efficient alternative for industrial metal heat treatments.

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