This study investigates the dynamic reaction between liquid gallium and aluminum, which poses a challenge when using high-performance gallium-rich thermal interface materials for electronic cooling. Through the usage of in-situ microscopy, we show that while aluminum oxide coatings slow gallium-induced damage, nanometer-thick iridium coatings effectively prevent reaction and surface degradation at device-operating temperatures. These findings highlight a promising thermal-cooling architecture for extending the lifespan and reliability of high-power electronic heat dissipation systems.
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